Micro RFID tag with conductive interface

ABSTRACT

A micro radio frequency identification tag for use on articles in an equipment identification and tracking system includes a substrate, an RFID chip, a power storage means, an antenna, and a conductive means. The substrate has a pair of surfaces. The RFID chip and power storage means are operatively retained on one surface. The antenna is operatively retained on the other surface of the substrate and acts as a conductive layer. The conductive means extends between the surfaces of the substrate to operatively connect the antenna to the RFID chip and power storage means.

CROSS-REFERENCE TO RELATED APPLICATION

This application is a continuation of U.S. patent application Ser. No.16/222,218, filed Dec. 17, 2018, which claims the benefit of U.S.Provisional Patent Application No. 62/609,820, filed Dec. 22, 2017.

BACKGROUND OF THE INVENTION Field of the Invention

The subject disclosure relates generally to equipment identification andequipment tracking systems. More particularly, the subject disclosurerelates to a system for identifying and tracking medical or industrialarticles and/or equipment that are exposed to or utilized in extremeenvironmental conditions. More specifically, the subject disclosurerelates to a micro radio frequency identification tag assembly thatincludes a conductive interface which is operatively mounted to asurgical instrument for identifying and tracking the surgical instrumentprior to and following use in the operating room.

Background Art

Identification and tracking of articles and other equipment is generallywell known. In particular, identification and tracking of articles, suchas industrial equipment and tools or surgical instruments, has beenutilized to ensure proper maintenance and use-life schedule as well asto monitor the physical location of the articles. Typically, the processof identification and tracking is accomplished through manual recordkeeping, visual inspection, and processing of the articles orinstruments. More particularly, identification of the articles istypically provided through visual marking, such as mechanical etching orcolor-coded films or bands, which allow for non-specific identificationof the article. However, because the articles may be grouped togetherindiscriminately for processing, identification and tracking, usingvisual markings lacks specificity and requires an increased amount oftime for workers to accomplish.

In order to increase the specificity and speed of identification andtracking, electronic identification technology has been developed toprovide unique tracking of certain articles. In particular, radiofrequency identification (“RFID”) systems have been adapted foridentification and tracking of various assets and articles and aregenerally well known. RFID systems typically use reusable RFID tagsmounted on, or embedded in, an article to be tracked. These mounted RFIDtags allow for tracking of the article through gathering processes, use,and maintenance.

Prior art RFID tags are generally formed on a substrate and include anintegrated circuit with memory and logic components. Prior art RFID tagsmay also include other components, such as a power sources, transistors,diodes, and transmission mechanisms. Typically, the memory componentinteracts with the logic component, allowing the storage of data,typically identification information, such as an identification number,that corresponds to the article on which the RFID tag is mounted. Thememory component may also allow new or additional information to bestored or, together with the logic component, may allow the RFID tag tomanipulate data or perform additional functions. Other components, suchas a capacitor or power source provide electrical energy for the logicand memory components to operate. Other components, such as transmissionmechanisms or antennas, allow data to be transmitted between the RFIDtag and a radio frequency reader or field generator. The memory, logic,and other components are typically formed in or mounted on thesubstrate. The assembled RFID tag including the memory, logic, and othercomponents may then be encapsulated in some material for protection.

Prior art RFID tags typically operate by either active or passive means.Active RFID tags generally have a discrete power source, such as abattery. The battery is activated, or turned on, by an external means,such as a radio frequency (“RF”) field produced by an RF reader or fieldgenerator, allowing the battery to power the logic and memorycomponents. Passive RFID tags are typically inductively or capacitivelyenergized and activated by external means. In particular, passive RFIDtags require energization by an RF field. Inductive RFID tags typicallyhave a metal wire wound into a coil acting as an antenna. The antennacreates an induction charge in the presence of the electromagneticenergy of the RF field. The induction charge, in turn, powers the logicand memory components. Capacitive RFID tags have a conductive inkapplied to a silicon substrate acting as an antenna. The conductive inkon the silicon substrate has a similar effect as in an inductive RFIDtag when exposed to an electromagnetic wave generated by the RF readeror field generator. When exposed to an RF field, both active and passiveRFID tags are activated and modulate the RF field to transmit data backto the RF reader. In particular, the logic component executes all datafunctions, such as retrieving stored data from the memory component andtransmitting the retrieved data. Thus, prior art RFID tags provide ameans of remotely accessing and retrieving information encoded thereinrelevant to the articles to be tracked for effective identification,monitoring, and control of the article through industrial processes,use, and maintenance.

Prior art RFID tags, while satisfactory for their intended functions,have disadvantages, drawbacks, and limitations. For example, the readrange, or the distance from which a prior art passive RFID tag can beread, is relatively low, requiring an RF reader to be in close proximityto the RFID tag in order to retrieve the data. This reduces theefficiency and speed with which a large number of articles fitted withRFID tags can be identified and tracked through typical industrialand/or medical processes and use. Moreover, prior art RFID tags mustalso be smaller and shaped to compliment the contour of the article inorder to prevent interference with use of the article to which the RFIDtag is mounted. Smaller prior art RFID tags have shorter antennaelengths, resulting in a lower transmitted signal gain, which reduces theread range of the prior art RFID tags. As a result, prior art RFID tagsare only readable at very close distances, usually in the range of fromabout 6 in. (152.4 mm) to 12 in (304.8 mm). To extend the read range,prior art RFID tags often have increased antenna lengths. However,increasing antenna length undesirably increases the overall size andadversely changes the shape of the prior art RFID tag.

Alternatively, prior art RFID tags may increase the available charge tothe logic component. This, in turn, may increase the transmission signaloutput power, thereby increasing the read range. However, increasing theavailable charge in prior art RFID tags generally requires additionalcomponents, such as a supplementary power supply or batteries, whichincrease the size and weight of the prior art RFID tags. Mounting ofsuch large prior art RFID tags to delicate articles may be difficultand/or require placement of the RFID tag on the article in a manner thatcauses the RFID tag to obstruct or interfere with the normal operationof the article or predisposes the RFID tag to damage or incidentalremoval during industrial processes, use, sterilization, or maintenance.

The present invention overcomes the disadvantages, drawbacks, andlimitations of prior art RFID tags by providing a micro RFID tag with aconductive surface that contacts the surface of an article to which themicro RFID tag is mounted. More specifically, the micro RFID tag of thesubject disclosure has a substrate with an antenna acting as aconductive surface which is in contact with the surface of the articleto which the micro RFID tag is mounted. The antenna acting as aconductive surface effectively extends the operating length of theantenna of the micro RFID tag, which increases the read range. Inaddition, the micro RFID tag includes additional capacitors operativelyconnected to the antenna and a logic means to provide greater charge tothe antenna and the logic means, increasing output power and read rangeof the micro RFID tag. An encapsulation layer disposed around at least aportion of the micro RFID tag provides the micro RFID tag of the subjectdisclosure with protection from chemicals, impacts, and extremetemperatures. As a result, the overall size and weight of the micro RFIDtag of the subject disclosure is elongated and relatively small in widthand height, allowing for increased read range and easier mounting on thearticle without obstructing the normal operation of the article.

SUMMARY OF THE INVENTION

Objectives of the subject disclosure include providing a micro RFID tagwith a conductive surface to provide increased read range of the microRFID tag.

A further objective of the subject disclosure is to provide a micro RFIDtag with a conductive surface to provide increased available charge,output power, and read range of the RFID tag.

Yet another objective of the subject disclosure is to provide a microRFID tag with a conductive interface that is easier to mount to thearticle without increasing the size and weight of the micro RFID tag orobstructing the normal operation of the article.

Still another objective of the subject disclosure is to provide a microRFID tag with a conductive interface that is capable of withstandingimpacts, chemical exposure, and extreme temperatures which the tag maybe exposed to during industrial processes, use, and maintenance of thearticle to which it is attached.

These objectives and advantages are obtained by the micro RFID tag foruse on an article in an equipment identification and tracking system ofthe subject disclosure including a substrate, an RFID chip, a powerstorage means, an antenna, and a conductive means. The substrate has asurface onto which the RFID chip and power storage means are operativelyretained. The substrate has another surface on which the antenna isoperatively retained. The antenna also acts as a conductive layer. Theconductive means extends between the surfaces and operatively connectsthe antenna to the RFID chip and power storage means.

These objectives and advantages are also obtained by the method ofutilizing a micro radio frequency identification tag with an article inan equipment identification and tracking system, including the methodsteps of: 1) providing an RFID tag, the RFID tag including a substrate,an RFID chip, a power storage means, and an antenna operatively retainedon the substrate, the antenna also acting as a conductive layer; aconductive means to operatively connect the antenna to the RFID chip andthe power storage means, 2) encapsulating at least a portion of the RFIDtag with an encapsulant, 3) adhering the non-encapsulated conductivelayer of the RFID tag to an article to be identified and tracked.

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS

The following description and drawings set forth certain illustrativeaspects and implementations of the subject disclosure. The drawings areindicative of but a few of the various ways in which one or more aspectsor implementations may be employed. Further features of the subjectdisclosure will become apparent from reading the following descriptionwith references to the accompanying drawings in which:

FIG. 1 is a top view of an article having a first exemplary embodimentmicro RFID tag, according to the subject disclosure, mounted thereon;

FIG. 2 is a perspective view of the first exemplary embodiment microRFID tag, according to the subject disclosure;

FIG. 2A is a side elevational view of the first exemplary embodimentmicro RFID tag, according to the subject disclosure;

FIG. 2B is an end elevational view of the first exemplary embodimentmicro RFID tag, according to the subject disclosure;

FIG. 2C is a top plan view of the first exemplary embodiment micro RFIDtag, according to the subject disclosure;

FIG. 3 is a top plan view of a substrate assembly of the first exemplaryembodiment micro RFID tag, according to the subject disclosure, prior tobeing mounted with the integrated components;

FIG. 4 is a bottom plan view of the substrate assembly, shown in FIG. 3,showing a conductive layer and communication bores;

FIG. 5 is an enlarged fragmentary top plan view of portions of thesubstrate assembly, shown in FIG. 3, with the integrated componentsattached;

FIG. 6 is an elevational view in section of the substrate assembly ofthe first exemplary embodiment micro RFID tag, according to the subjectdisclosure, positioned for insertion into an encapsulation process mold;

FIG. 7 is a bottom plan view of the substrate assembly, shown in FIG. 6,disposed within the encapsulation process mold;

FIG. 8 is a cross-sectional view of the first exemplary embodiment microRFID tag, according to the subject disclosure, mounted on the article;

FIG. 9 is an enlarged cross-sectional view of a portion of the firstexemplary embodiment micro RFID tag, shown in FIG. 8, showing aconductive bridge through a bore between the substrate surfaces forcontact between the substrate assembly and the article;

FIG. 10 is a top plan view of a second exemplary embodiment of anelongated micro RFID tag, according to another aspect of the subjectdisclosure;

FIG. 10A is a greatly enlarged view of a portion of the second exemplaryembodiment micro RFID tag, shown in FIG. 10, showing the traceinterconnect segments situated generally below the RFID assembly;

FIG. 11 is a top plan view of the second exemplary embodiment micro-RFIDtag shown in FIG. 10, showing the RFID assembly and capacitors removed;and

FIG. 11A is a greatly enlarged view of a portion of the second exemplaryembodiment micro RFID tag, shown in FIG. 11.

Similar reference characters identify similar parts throughout thedrawings.

DESCRIPTION OF THE PREFERRED EMBODIMENT

An article 170, such as a surgical instrument, is illustrated in FIG. 1with a first exemplary embodiment micro RFID tag 100, according to thesubject disclosure, mounted thereon. First exemplary embodiment microRFID tag 100 includes a substrate assembly 110 (FIGS. 3-5) and anencapsulation layer 160 (FIG. 8) partially or wholly surrounding thesubstrate assembly. Substrate assembly 110 has a non-conductive supportsubstrate 112 formed from any suitable material, such as fiberglass orother glass epoxy, as is known. Substrate 112 is a single-layerconstruction and may have a flat printed circuit board (“PCB”)configuration with a longitudinal central axis A. Alternatively,substrate 112 may have a multi-layer construction formed from a suitableprocess, such that substrate 112 may have multiple integrated circuitsand interconnections spanning multiple layers. Substrate 112 generallyincludes an upper surface 120; elongated, parallel, spaced-apartopposing side edges 114, 116; opposing ends 118; and a flat bottom orengagement surface 121. The engagement surface 121 operatively retains aconductive coating or antenna 121A over at least a portion of theengagement surface. Antenna 121A is formed by any suitable process fromany suitable material, such as metallic foil or conductive ink. Uppersurface 120 generally includes a pair of conductive trace interconnects122, 124, anchors 126, 127, 128, and communication bores 130, 132.

With continued reference to FIGS. 3-5, anchors 126, 127, 128 includeindividual component solder attachment pads 126A and 126B, 127A and127B, 128A and 128B, respectively. Each of the attachment pads 126A,126B, 127A, 127B, 128A, 128B may be formed using any suitable processfrom any suitable material, such as metallic foil or conductive ink, asis known, which allows for the use of solder material to attachcomponents to the attachment pads. Anchors 126, 127, 128 may be arrangedon upper surface 120 in any suitable manner allowing for the attachmentor mounting of any suitable components. More preferably, anchors 126,127 are spaced apart and operatively retained on upper surface 120 alongconductive trace interconnect 122 between longitudinal central axis Aand edge 114. Anchor 128 is operatively retained on upper surface 120along conductive trace interconnect 124 between longitudinal centralaxis A and edge 116. Anchor 128 is generally symmetrically aligned andequidistant from anchors 126, 127. Anchor 128 may have an RFID assemblyor encoded chip 140 attached by any suitable means to provide electricalconduction between the attachment point and the RFID encoded chip. RFIDencoded chip 140 may be of any suitable size and include an integratedor discrete memory means or device, such as flash memory, to store data,such as a unique identification number, as is known. RFID encoded chip140 may also include an integrated transmitter for broadcasting the datastored in any integrated or discrete memory means or device, as isknown. As a result, RFID encoded chip 140 may overlie portions of traceinterconnects 122, 124 without contacting the interconnects. Anchors126, 127 may have dedicated antenna-enabled capacitors 142 similarlyattached by any suitable electrically conductive means. Alternatively,other components, such as discrete memory means or devices, separatepower sources, and the like, may be attached to any number of otheranchors on either upper surface 120 or engagement surface 121. It shouldbe understood that RFID encoded chip 140 could be an SMT Packaged Chip,without changing the overall concept or operation of the subjectdisclosure.

Trace interconnects 122, 124 are generally formed using any suitableprocess from any suitable material, such as metallic foil, conductiveink, wire, or the like, and extend in spaced parallel relation to oneanother. Trace interconnect 122 is formed from one or more segments122A, 122 B, 122C, preferably in symmetric spaced relationship withanchor 128, trace interconnect 124, and bores 130,132. Similarly, traceinterconnect 124 is formed from a pair of segments 124A, 124B. Traceinterconnect segments 122A, 122C overlie and extend from communicationbores 130, 132, respectively, and terminate into attachment pads 126A,127B, respectively, of anchors 126, 127. Trace interconnect segment 122Bextends between and terminates into attachment pads 126B, 127A. As aresult, trace interconnect 122 is operatively connected to and bridgesbetween capacitors 142. Trace interconnect segments 124A, 124B overlieand extend from communication bores 130, 132, respectively, andterminate into attachment pads 128A, 128B, respectively, of anchor 128.As a result, trace interconnect 124 is operatively connected to RFIDencoded chip 140.

Communication bores 130, 132 are each arranged proximate to a respectiveopposite end 118 of substrate 112. Communication bores 130, 132 may eachform a pair of openings on upper surface 120 and extend throughsubstrate 112 to engagement surface 121. Alternatively, communicationbores 130, 132 may form any number of openings or other conductivemeans, such as wires, a rivet, a plated opening or opening filled withconductive ink, or the like, which may extend partially or completelythrough substrate 112. Conductive communication sleeves 136 (FIG. 9)line or extend through each of communication bore 130, 132. Sleeves 136may be formed using any suitable process from any suitable material,such as metallic foil, wire, plating, conductive fill, rivets, or thelike, and include radially-outwardly extending flanges or engagementlips 136A at opposite ends of the sleeves. Engagement lips 136A of eachsleeve 136 operatively contact or engage trace interconnects 122, 124and antenna 121A. More particularly, sleeves 136 provide a conductivecommunication bridge from trace interconnect 122 to antenna 121A and totrace interconnect 124, creating a conductive bridge between RFIDencoded chip 140, capacitors 142, and antenna 121A. Preferably, thestructural components are arranged with symmetrical balance. As aresult, capacitors 142 provide an increased and uniformly balancedcharge to RFID encoded chip 140, increasing the output power of thetransmitter of the RFID encoded chip, thereby increasing the read rangeof micro RFID tag 100.

Turning now to FIGS. 6-7, encapsulation layer 160 may be formed by anysuitable method or technique using any suitable material capable ofwithstanding extreme temperature and pressure. In particular,encapsulation layer 160 may be formed using a material molding process.A mold 150 has an upper surface 152. Upper surface 152 has a contoured,elongated recess or receiving channel 154 adapted to be filled with anencapsulation material R, such as an epoxy, for example EpoxAcast™ 670HT (Smooth-On, Inc.), or other suitable resin. Encapsulation material Rmay include specialized components or additives that provide or enhancespecific physical or mechanical properties of the material. Inparticular, encapsulation material R may include an additive to increasethe flexibility of the cured material, such as Flexer® EpoxyFlexibilizer (Smooth-On, Inc.). As a result, once cured, encapsulationmaterial R may have reduced hardness, providing flexibility to conformto article 170 and preventing damage to encapsulation layer 160 orsubstrate assembly 110 from impacts. Encapsulation material R, oncecured may have a Shore hardness in the range of from about 45 D to about110 D, and more preferably from about 70 D to about 85 D. In addition,encapsulation material R, when cured, may be capable of withstandingextreme temperatures, such as those that first exemplary embodimentmicro RFID tag 100 may be exposed to in industrial and/or medicalprocesses, use, and maintenance. Encapsulation material R may be capableof withstanding temperatures in the range of from about −58° F. to about425° F. More preferably, encapsulation material R may have a hightemperature tolerance above 302° F., or the temperature commonly used insterilization or cleaning processes, such as autoclaving. Substrateassembly 110 may be inverted and disposed within encapsulation materialR to submerge all or a portion of the substrate assembly, includingupper surface 120; edges 114, 116; and ends 118. Once encapsulationmaterial R is cured or set, the first exemplary embodiment micro RFIDtag 100 may be removed from mold 150 and mounted on article 170 for use.

Alternatively, encapsulation layer 160 may be formed about substrateassembly 110 using an injection molding process. Generally, a pluralityof substrate assemblies 110 may be placed in an appropriately shapedblock or mold (not shown). The block may then have any suitableinjectable polymer or material, such as Grilamid (EMS-Grivory), pushedinto the block or mold. The injectable material may have slightlydifferent properties from encapsulation material R described above. Inparticular, the injectable material may have a greater preferred Shorehardness in the range of from about 65 D to about 85 D. The injectablematerial is allowed to cool and the block is opened to release theencapsulated first exemplary embodiment micro RFID tag 100, which maythen be mounted on an article 170 for use.

In accordance with an important aspect of the subject disclosure,antenna 121A on engagement surface 121 also acts as a conductive layerto provide electrically conductive communication between substrateassembly 110 and article 170, as shown in FIGS. 8-9. In particular,micro RFID tag 100 is generally fixedly mounted on article 170 in orderto identify and track the article through various industrial and/ormedical processes, use, and maintenance. First exemplary embodimentmicro RFID tag 100 is mounted on article 170 using any suitablemechanical or chemical methods and materials, such as conductiveadhesive, capable of ensuring a strong bond resistant to extremeconditions and chemical exposure as well as providing conductivecommunication between the article and antenna 121A. Upon mounting offirst exemplary embodiment micro RFID tag 100, engagement surface 121 ofsubstrate 112 contacts article 170 or may be separated by a thin layerof adhesive, encapsulation material R, or the like. More particularly,antenna 121A may be in intimate contact with metallic surface 172 ofarticle 170. As a result, a conductive bridge is formed betweencapacitors 142, RFID encoded chip 140, interconnects 122, 124, andarticle 170. The resulting conductive bridge effectively extends thelength of the antenna 121A, allowing first exemplary embodiment microRFID tag 100 to have increased signal gain, thereby increasing the readrange of the micro RFID tag.

Thus the improved first exemplary embodiment micro RFID tag 100 of thesubject disclosure provides substrate assembly 110 with capacitors 142and trace interconnects 122, 124 to increase power output of RFIDencoded chip 140, extends the effective length of antenna 121A byproviding an interface with the conductive article and providesprotection from impacts, chemicals, and extreme temperatures viaencapsulation layer 160. As a result, the overall elongated shape, size,and weight of first exemplary embodiment micro RFID tag 100 of thesubject disclosure is optimized and reduced or maintained, yet allowsfor increased read range and easier mounting on article 170 withoutobstructing the normal operation of the article.

Turning now to FIGS. 10-11A, a second exemplary embodiment micro RFIDtag 200 according to another aspect of the subject disclosure is shown.Second exemplary embodiment micro RFID tag 200 is similar to firstexemplary embodiment micro RFID tag 100 in construction and arrangement.As a result, the description below will be primarily directed to thedifferences between first exemplary embodiment micro RFID tag 100 andsecond exemplary embodiment micro RFID tag 200.

Second exemplary embodiment micro RFID tag 200 includes a substrateassembly 210 and an encapsulation layer 260 partially or whollysurrounding the substrate assembly. Substrate assembly 210 has anon-conductive support substrate 212 formed as a single layerconstruction including an upper surface 220; elongated, parallel,spaced-apart opposing side edges 214, 216; opposing ends 218; a flatbottom or engagement surface (not shown), and a longitudinal centralaxis A′. The engagement surface operatively retains a conductive coatingor antenna 221A over at least a portion of the engagement surface. Uppersurface 220 generally includes a pair of conductive trace interconnects222, 224, anchors 226, 227, 228, and communication bores 230, 232.

Anchors 226, 227, 228 include individual component solder attachmentpads 226A, 226B, 227A, 227B, 228A, 228B, respectively. Anchors 226, 227,228 may be arranged on upper surface 220 in any suitable manner allowingfor the attachment or mounting of any suitable components. Morepreferably, anchors 226, 227 are spaced apart and operatively retainedon upper surface 220 between longitudinal central axis A′ and edge 214.Anchor 228 is operatively retained on upper surface 220 partiallyoverlaying longitudinal central axis A′ adjacent edge 216. Anchors 226,227 are generally equidistant from anchor 228, preferably in symmetricspaced relationship with anchor 228, trace interconnect 224, and bores230, 232. Anchor 228 may have an RFID assembly or encoded chip 240attached by any suitable means to provide electrical conduction betweenthe attachment point and the RFID assembly. RFID assembly 240 may be ofany suitable size and include an integrated or discrete memory means ordevice, such as flash memory, to store data, such as a uniqueidentification number, as is known. RFID assembly 240 may also includean integrated transmitter for broadcasting the data stored in anyintegrated or discrete memory means or device. RFID assembly 240generally extends over longitudinal central axis A′ and is adjacent toedge 214 and edge 216, nearly occupying the entire width of substrate212. Anchors 226, 227 may have dedicated antenna-enabled capacitors 242similarly attached by any suitable electrically conductive means anddisposed in a manner preventing contact with RFID assembly 240.Alternatively, other components, such as discrete memory means ordevices, separate power sources, and the like, may be attached to anynumber of other anchors on either upper surface 220 or the engagementsurface (not shown).

Trace interconnects 222, 224 are generally formed from an appropriatematerial, such as metallic foil, conductive ink, or wire, and extend inspaced parallel relation to one another. Trace interconnect 222 isformed from one or more segments 222A, 222B, 222C. Similarly, traceinterconnect 224 is formed from a pair of segments 224A, 224B. Traceinterconnect segments 222A, 222C overlie and extend from communicationbores 230, 232, respectively, and terminate into attachment pads 226A,227B, respectively, of anchors 226, 227. Trace interconnect segment 222Bextends between and terminates into attachment pads 226B, 227A. Moreparticularly, trace interconnect segment 222B may be partially or whollyretained on edge 214 to prevent RFID assembly 240 from contacting thesegment. As a result, trace interconnect 222 is operatively connected toand bridges between capacitors 242. Trace interconnect segments 224A,224B overlie and extend from communication bores 230, 232, respectively,and terminate into attachment pads 228A, B, respectively, of anchor 228.As a result, trace interconnect 224 is operatively connected to RFIDassembly 240.

Thus the improved second exemplary embodiment micro RFID tag 200 of thesubject disclosure provides substrate assembly 210 with capacitors 242and interconnects 222, 224 to increase power output of RFID assembly240, extends the effective length of antenna 221A by providing aninterface with the conductive article, and provides protection fromimpacts, chemicals, and extreme temperatures via encapsulation layer260. As a result, the overall elongated shape, size, and weight ofsecond exemplary embodiment micro RFID tag 200 of the subject disclosureis optimized and reduced or maintained, allowing for increased readrange and easier mounting on an article (not shown) without obstructingthe normal operation of the article.

It should be understood that alternate configurations of first andsecond exemplary embodiment micro RFID tags 100, 200 of the subjectdisclosure could be utilized without changing the overall concept oroperation of the subject disclosure. It should also be understood thatother types of capacitors and RFID encoded chips and assemblies could beutilized without changing the overall concept or operation of thesubject disclosure. It should be understood that first and secondexemplary embodiment micro RFID tags 100, 200 of the subject disclosurecould be encapsulated with any material having the preferred range oftemperature and hardness characteristics, without changing the overallconcept or operation of the subject disclosure. It is understood thatfirst and second exemplary embodiment micro RFID tags 100, 200 of thesubject disclosure could have other shapes, sizes, bore placements, andcircuit designs, preferably in a symmetrical spaced relationship,without changing the overall concept or operation of the subjectdisclosure.

Accordingly, first and second exemplary embodiment micro RFID tags 100,200 of the subject disclosure are simplified, provide an effective,safe, inexpensive, and efficient structure and method which achieve allthe enumerated objectives, provide for eliminating difficultiesencountered with prior art micro RFID tags, and solve problems andobtain new results in the art.

In the foregoing description, certain terms have been used for brevity,clearness and understanding; but no unnecessary limitations are to beimplied therefrom beyond the requirements of the prior art, because suchterms are used for descriptive purposes and are intended to be broadlyconstrued.

Moreover, the description and illustration of the invention is by way ofexample, and the scope of the invention is not limited to the exactdetails shown or described.

Having now described the features, discoveries and principles of theinvention, the manner in which first and second exemplary embodimentmicro RFID tags 100, 200 are used and installed, the characteristics ofthe construction, arrangement and method steps, and the advantageous,new and useful results obtained; the new, unique, and useful structures,devices, elements, shapes, arrangements, process, parts and combinationsare set forth in the appended claims.

What is claimed is:
 1. A micro radio frequency identification tag foruse on an article in an equipment identification and tracking system,the micro radio frequency identification tag comprising: a substratehaving a first surface and a second surface, each one of said surfacesincluding a width and a longitudinal length, said longitudinal lengthbeing greater than said width; an RFID chip operatively retained on thefirst surface by an anchor; a power storage means, said power storagemeans comprising at least a pair of capacitors operatively retained onthe first surface, said RFID chip being spaced between said capacitors;a continuous planar antenna operatively retained on the second surface,said antenna enabling communication between said substrate and saidarticle; and a conductive means extending between the first surface andthe second surface to operatively connect the antenna to the RFID chipand the power storage means.
 2. The micro radio frequency identificationtag of claim 1, further comprising an encapsulation layer.
 3. The microradio frequency identification tag of claim 2, the encapsulation layercomprising an injection moldable polycarbonate.
 4. The micro radiofrequency identification tag of claim 2, the micro radio frequencyidentification tag being one or a plurality of micro radio frequencyidentification tags disposed about a reel dispenser.
 5. The micro radiofrequency identification tag of claim 2, the encapsulation layerencompassing the RFID chip, the power storage means, the antenna, andthe first surface of the substrate.
 6. The micro radio frequencyidentification tag of claim 5, the encapsulation layer including anadditive for flexibility.
 7. The micro radio frequency identificationtag of claim 6, the encapsulation layer having a Shore hardness in therange from about 45 D to about 110 D.
 8. The micro radio frequencyidentification tag of claim 5, the encapsulation layer comprising achemical resistant polymer or composite.
 9. The micro radio frequencyidentification tag of claim 5, the encapsulation layer comprising apolymer or composite capable of withstanding temperatures in the rangeof about −58° F. to about 425° F.
 10. The micro radio frequencyidentification tag of claim 5, the encapsulation layer comprising apolymer or composite capable of withstanding gaseous sterilization. 11.The micro radio frequency identification tag of claim 1, the RFID chipfurther comprising an assembly including distinct memory means.
 12. Themicro radio frequency identification tag of claim 1, the conductivemeans further comprising a conductive foil sleeve extending through anopening of the substrate and operatively connected between the antennaand at least one interconnect conductively connecting the RFID chip andthe power storage means.
 13. The micro radio frequency identificationtag of claim 1, the micro radio frequency identification tag beingoperatively mounted on the article; wherein the antenna acting as theconductive layer operatively contacts the article enabling electricalconductance between the article and the micro radio frequencyidentification tag.
 14. The micro radio frequency identification tag ofclaim 13, the article further comprising a medical instrument.
 15. Themicro radio frequency identification tag of claim 14, wherein the microradio frequency identification tag is mounted on the medical instrumentin a position not affecting the structure or function of the medicalinstrument.
 16. The micro radio frequency identification tag of claim14, the medical instrument being one of a plurality of instrumentscomprising a surgical kit; wherein the surgical kit has a differentmicro radio frequency identification tag mounted thereon.
 17. The microradio frequency identification tag of claim 1, wherein the RFID chip iscapable of being induced by a radio frequency field generator from adistance of about 5 feet to about 7 feet.
 18. The micro radio frequencyidentification tag of claim 1, the conductive means further comprising apair of bores and a pair of trace interconnects; wherein said conductivemeans and said power storage means are in a symmetric spacedrelationship with said RFID chip.
 19. A method of utilizing a microradio frequency identification tag with an article in an equipmentidentification and tracking system, comprising the method steps of: 1)providing an RFID tag, said RFID tag including a substrate having afirst surface and a second surface, each one of said surfaces includinga width and a longitudinal length, said longitudinal length beinggreater than said width; an RFID chip operatively retained on the firstsurface by an anchor; a power storage means, said power storage meanscomprising at least a pair of capacitors operatively retained on thefirst surface, said RFID chip being spaced between said capacitors; acontinuous planar antenna operatively retained on the substrate, saidantenna enabling communication between said substrate and said article;and a conductive means to operatively connect the antenna to the RFIDchip and the power storage means, 2) encapsulating at least a portion ofsaid RFID tag with an encapsulant, 3) adhering the non-encapsulatedconductive layer of the RFID tag to an article to be identified andtracked.
 20. A micro radio frequency identification tag for use on anarticle in an equipment identification and tracking system, the microradio frequency identification tag comprising: a substrate having afirst surface and a second surface, each one of said surfaces includinga width and a longitudinal length, said longitudinal length beinggreater than said width; an RFID chip operatively retained on the firstsurface by an anchor; a power storage means, said power storage meanscomprising at least a pair of capacitors operatively retained on thefirst surface, said RFID chip being spaced between said capacitors; anantenna operatively retained on the second surface and extending alongsaid longitudinal length of said second surface, said antenna enablingcommunication between said substrate and said article; and a conductivemeans extending between the first surface and the second surface tooperatively connect the antenna to the RFID chip and the power storagemeans.